DIP led sizes f3 green 

                                                                                         DIP led sizes f3 GREEN   Taking "Dual In-line Package LED" (DIP LED) as an example, the following figure briefly illustrates the LED packaging ( DIP led f3  Green) process. After passing the test, the bare die drawn on the wafer is placed on the base that supports and fixes it (there is also a layer of material with good heat dissipation on the base), and then multiple metal wires are used to connect the die. The metal contact points (Pad, pad) on the Die are connected to the external pins by welding, and then embedded in resin and sealed with a plastic tube to form the DIP LED chip as a whole. The naming of DTCP in the standard of the Japan Electromechanica…