Ultra-Low Friction OCA Release Film for Advanced Adhesive Applications – Tape Backing, Label Facestock & Photovoltaic Encapsulation Solutions Engineered for high-performance industrial bonding and encapsulation needs, this advanced OCA (Optically Clear Adhesive) release film delivers exceptional dimensional stability, precision coating compatibility, and ultra-low friction coefficient properties. Designed specifically for tape backing, label facestock, and photovoltaic module encapsulation applications, it ensures consistent adhesion control while minimizing surface resistance during processing. With a carefully optimized release force profile and excellent compatibility with UV-curable and thermally activated adhesives, this film is a critical component in modern manufacturing environments demanding accuracy, repeatability, and durability. Key features include a low friction coefficient of less than 0.15, which significantly reduces drag during automated winding, slitting, an…
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